How to win: Die Bonding System

About this contract

Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.

How to win contracts like this

• ✓Answer against the marking scheme, not the question text — University of Bristol scores each response, so map your evidence to the published criteria and weightings.
• ✓At £215,000, expect quality and social value to carry a large share of the score — price alone rarely wins goods work.
• ✓Show recent, comparable delivery: name similar goods contracts you've delivered for public bodies, with measurable outcomes.
• ✓Start early: it closes 16 July 2026 and a strong bid takes iteration.

BidWriter drafts your responses from your company profile, scores them against the marking scheme, and tracks your whole pipeline. Free to start — no card needed.

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