How to win: Supply, Delivery, Installation & Commissioning of a Die Inspection Sorter

About this contract

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.

How to win contracts like this

• ✓Answer against the marking scheme, not the question text — University of Strathclyde scores each response, so map your evidence to the published criteria and weightings.
• ✓At £1,160,000, expect quality and social value to carry a large share of the score — price alone rarely wins goods work.
• ✓Show recent, comparable delivery: name similar goods contracts you've delivered for public bodies, with measurable outcomes.
• ✓Start early: it closes 1 September 2026 and a strong bid takes iteration.

BidWriter drafts your responses from your company profile, scores them against the marking scheme, and tracks your whole pipeline. Free to start — no card needed.

Related resources

Similar contracts