How to win: Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder

About this contract

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.

How to win contracts like this

• ✓Answer against the marking scheme, not the question text — University of Strathclyde scores each response, so map your evidence to the published criteria and weightings.
• ✓Lead with evidenced capability and social value — for goods work these usually outweigh price.
• ✓Show recent, comparable delivery: name similar goods contracts you've delivered for public bodies, with measurable outcomes.
• ✓Start early: it closes 4 September 2026 and a strong bid takes iteration.

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