How to win: Supply, Delivery and Installation of Solder Jetting Equipment

About this contract

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description A Solder Jetting capability is required to process photonic and semiconductor devices to allow them to be integrated into advanced packages.

How to win contracts like this

• ✓Answer against the marking scheme, not the question text — University of Strathclyde scores each response, so map your evidence to the published criteria and weightings.
• ✓Lead with evidenced capability and social value — for goods work these usually outweigh price.
• ✓Show recent, comparable delivery: name similar goods contracts you've delivered for public bodies, with measurable outcomes.
• ✓Start early: it closes 31 August 2026 and a strong bid takes iteration.

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