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Habitable Worlds Observatory Detector. Qualification testing of bespoke CIS300 series UVIS detectors. This work is being performed under the remit of a UK Space Agency (UKSA) research grant, with costs for the procurement of this equipment specifically stated within the UKRI offer letter. This phase of work being performed by the OU is taking place in the broader context of a NASA led mission (HWO). The critical success factors for this phase of the activity are completion/delivery of the following items by 31/02/2027: CIS303-33: o Part thinning (to pre-AR coat) of 6 off wafers. Each wafer has 4 (unyielded) devices on it. o 8 Invar PCB packages • CIS303-66 o Part thinning (to pre-AR coat) of 4 off wafers. Each wafer has 1 (unyielded) device on it. o 4 Silicon Carbide Packages. • Back-thinning report • CIS300 test equipment o latest build standard of the Te2v CEB. o Interconnect board. o Flex rigid PCB. • FPGA update o As the requirements for this update are unknown a nominal number has been assumed, once the requirements are confirmed this cost may increase or reduce. Phase 2 would follow on to 31/03/2030, if required.
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